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BGS12AL7-6
SPDT RF Switch
Data Sheet
Revision 2.0, 2009-11-24
Industrial & Multimarket
Edition 2009-11-24 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGS12AL7-6 SPDT RF Switch
BGS12AL7-6 SPDT RF Switch Revision History: 2009-11-24, Revision 2.0 Previous Revision: 2009-09-14, V1.3 Page 7 8 11 Subjects (major changes since last revision) Final Datasheet Features Functional Diagram max. Values for Insertion Loss, current consumtion at Vdd Pin
Trademarks of Infineon Technologies AG A-GOLDTM, BlueMoonTM, COMNEONTM, CONVERGATETM, COSICTM, C166TM, CROSSAVETM, CanPAKTM, CIPOSTM, CoolMOSTM, CoolSETTM, CONVERPATHTM, CORECONTROLTM, DAVETM, DUALFALCTM, DUSLICTM, EasyPIMTM, EconoBRIDGETM, EconoDUALTM, EconoPACKTM, EconoPIMTM, E-GOLDTM, EiceDRIVERTM, EUPECTM, ELICTM, EPICTM, FALCTM, FCOSTM, FLEXISLICTM, GEMINAXTM, GOLDMOSTM, HITFETTM, HybridPACKTM, INCATM, ISACTM, ISOFACETM, IsoPACKTM, IWORXTM, M-GOLDTM, MIPAQTM, ModSTACKTM, MUSLICTM, my-dTM, NovalithICTM, OCTALFALCTM, OCTATTM, OmniTuneTM, OmniViaTM, OptiMOSTM, OPTIVERSETM, ORIGATM, PROFETTM, PRO-SILTM, PrimePACKTM, QUADFALCTM, RASICTM, ReverSaveTM, SatRICTM, SCEPTRETM, SCOUTTM, S-GOLDTM, SensoNorTM, SEROCCOTM, SICOFITM, SIEGETTM, SINDRIONTM, SLICTM, SMARTiTM, SmartLEWISTM, SMINTTM, SOCRATESTM, TEMPFETTM, thinQ!TM, TrueNTRYTM, TriCoreTM, TRENCHSTOPTM, VINAXTM, VINETICTM, VIONTICTM, WildPassTM, X-GOLDTM, XMMTM, X-PMUTM, XPOSYSTM, XWAYTM. Other Trademarks AMBATM, ARMTM, MULTI-ICETM, PRIMECELLTM, REALVIEWTM, THUMBTM of ARM Limited, UK. AUTOSARTM is licensed by AUTOSAR development partnership. BluetoothTM of Bluetooth SIG Inc. CAT-iqTM of DECT Forum. COLOSSUSTM, FirstGPSTM of Trimble Navigation Ltd. EMVTM of EMVCo, LLC (Visa Holdings Inc.). EPCOSTM of Epcos AG. FLEXGOTM of Microsoft Corporation. FlexRayTM is licensed by FlexRay Consortium. HYPERTERMINALTM of Hilgraeve Incorporated. IECTM of Commission Electrotechnique Internationale. IrDATM of Infrared Data Association Corporation. ISOTM of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLABTM of MathWorks, Inc. MAXIMTM of Maxim Integrated Products, Inc. MICROTECTM, NUCLEUSTM of Mentor Graphics Corporation. MifareTM of NXP. MIPITM of MIPI Alliance, Inc. MIPSTM of MIPS Technologies, Inc., USA. muRataTM of MURATA MANUFACTURING CO. OmniVisionTM of OmniVision Technologies, Inc. OpenwaveTM Openwave Systems Inc. RED HATTM Red Hat, Inc. RFMDTM RF Micro Devices, Inc. SIRIUSTM of Sirius Sattelite Radio Inc. SOLARISTM of Sun Microsystems, Inc. SPANSIONTM of Spansion LLC Ltd. SymbianTM of Symbian Software Limited. TAIYO YUDENTM of Taiyo Yuden Co. TEAKLITETM of CEVA, Inc. TEKTRONIXTM of Tektronix Inc. TOKOTM of TOKO KABUSHIKI KAISHA TA. UNIXTM of X/Open Company Limited. VERILOGTM, PALLADIUMTM of Cadence Design Systems, Inc. VLYNQTM of Texas Instruments Incorporated. VXWORKSTM, WIND RIVERTM of WIND RIVER SYSTEMS, INC. ZETEXTM of Diodes Zetex Limited.
Last Trademarks Update 2009-10-19
Data Sheet
3
Revision 2.0, 2009-11-24
BGS12AL7-6 SPDT RF Switch
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 2 3 4 5 6 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Measurement Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Data Sheet
4
Revision 2.0, 2009-11-24
BGS12AL7-6 SPDT RF Switch
List of Figures
List of Figures
Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Functional Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Measurement Results (@ T = 25C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Application Board: No External Components Necessary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Deembedding Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package TSLP7-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Marking Info . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Board pad (SMD) & Apertures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Data Sheet
5
Revision 2.0, 2009-11-24
BGS12AL7-6 SPDT RF Switch
List of Tables
List of Tables
Table 1 Table 2 Table 3 Table 4 Table 5 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Operation Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Data Sheet
6
Revision 2.0, 2009-11-24
SPDT RF Switch
BGS12AL7-6
1
* * * * * * * * *
Features
Low insertion loss High port-to-port-isolation Low harmonic generation On-chip control logic, only one control line required High ESD robustness No external components required General purpose switch for applications up to 3 GHz Small leadless package TSLP-7-6 Lead and halogen free package (RoHS and WEEE compliant)
6 7 5 4
Main features:
1
2
3
Description The BGS12AL7-6 General Purpose RF MOS switch is designed to cover a broad range of applications from 30 MHz to 3 GHz. The symmetric design of its single pole double throw configuration, as shown in Figure 1 offers high design flexibility. This single supply chip integrates on-chip CMOS logic driven by a simple, single-pin CMOS or TTL compatible control input signal. The 0.1 dB compression point exceeds the switch's maximum input power level of 21 dBm, resulting in linear performance at all signal levels. The RF switch has a very low insertion loss of 0.4 dB in the 1 GHz and 0.5 dB in the 2 GHz range. Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally.
Product Name BGS12AL7-6 Data Sheet
Package TSLP7-6 7
Chip M4781
Marking 12 Revision 2.0, 2009-11-24
BGS12AL7-6 SPDT RF Switch
Features The BGS12AL7-6 RF switch is manufactured in Infineon's patented MOS technology, offering the performance of GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness.
RFin RF1 RF2
GND Decoder +ESD Vdd Ctrl
BGS 12AL 7-6_Functional_ Diagramm.vsd
Figure 1
Functional Diagram
Data Sheet
8
Revision 2.0, 2009-11-24
BGS12AL7-6 SPDT RF Switch
Maximum Ratings
2
Maximum Ratings
Table 1 Parameter
Maximum Ratings Symbol Min. Values Typ. - - - - - - Max. 150 5 24 1000 100 1500 - C V dBm V -65 - - - - - Unit Note / Test Condition - - - -
Storage temperature range DC Voltage at all pins to GND RF power max. at all RF ports ESD Capability Human Body Model IEC61340-3-1 Machine Model IEC61340-3-2 Charge Device Model JEDEC JESD22-C101D Table 2 Parameter Ambient temperature RF Frequency Control voltage low Control voltage high Supply voltage
1)
Tstg VDC PIN VESD
Operation Ranges Symbol Min. Values Typ. - - - - - - - - - - - Max. 85 3 0.3 Vdd 3.6 350 30 - 15 18 21 C GHz V V V A A dBm -30 0.03 -0.3 1.4 2.4 80 - - - - - Unit Note / Test Condition - - - - - - - - - - -
TA f VCtrL VCtrlH Vdd IVdd ICtrl Pin
Current consumption Vdd Pin (over temperature) Current Consumption Vctrl Pin Power Range (VSWR : 1) (VSWR 3: 1) (VSWR 1: 1)
1) Supply voltage must be connected before Control Voltage
Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit.
Data Sheet
9
Revision 2.0, 2009-11-24
BGS12AL7-6 SPDT RF Switch
Pin Description
3
Pin Description
Table 3 Pin No. 1 2 3 4 5 6 7
Pin Description Name RF2 GND RF1 Vdd RFIN CTRL NC Pin Type I/O GND I/O PWR I/O I NC Buffer Type Function RF Port 2 Out Ground RF Port 1 Out Supply Voltage RF Port In Control Pin It is recommended to connect Pin 7 to Ground
Ctrl 6
RFin 5
Vdd 4
7 Gnd
1 RF2
2 GND
3 RF1
T SLP7- 6.vsd
Figure 2 Table 4 Ctrl 1 0 1
Pin Configuration (top view) Truth Table RF 1 1 0 RF 2 0 1
Data Sheet
10
Revision 2.0, 2009-11-24
BGS12AL7-6 SPDT RF Switch
Electrical Specifications
4
* * * * *
Electrical Specifications
Termination port impedance: Z0 = 50 Temperature range: TA = -30 C...+85 C Supply Voltage: Vdd = 2.8 V Pin = 15 dBm Across operating range of control voltages: VCtrH = 1.4...2.8 V Electrical Characteristics Symbol Min. Values Typ. 0.3 0.5 20 15 50 32 25 50 32 25 50 32 25 30 20
2) 2) 2) 2) 2) 2) 2) 1)2) 1)
Test Conditions:
Table 5 Parameter
Unit Max. 0.51)2) 0.6 0.7 - - - - - - - - - - - - - - -50 -50 5 5 - -
1) 1)
Note / Test Condition
Insertion Loss
IL
- - -
dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm s s A dBm
f = 0.1 GHz TX, f = 1 GHz TX, f = 2 GHz TX, f = 0.1 GHz f = 1 GHz f = 2 GHz f = 0.1 GHz f = 1 GHz f = 2 GHz f = 0.1 GHz f = 1 GHz f = 2 GHz f = 0.1 GHz f = 1 GHz f = 2 GHz f = 1 GHz f = 2 GHz f = 1 GHz f = 2 GHz f = 1 GHz f = 1 GHz
-
0.35 302)
1)
Return Loss
RL
- 15 12
Isolation RFin - RF1
ISORFin-RF1
- 20 15
Isolation RFin - RF2
ISORFin-RF2
- 20 15
Isolation RF1 - RF2
ISORF1-RF2
- 24 15
Isolation RF ports - Vdd, Vctrl
ISORF-DC
25 15 - - - - - 21
2)
Harmonic Generation up to 12.75 GHz PHarm On Switching Time (10-90%) RF Off Switching Time (10-90%) RF Current Consumption at Vdd Pin Input 0.1 dB compression
-75 -80 32) 0.5 -
ton toff Idd P0.1dB
2)
140
f = 1 GHz
1) @TA= 25 C 2) Not measured in production, verified by design
Data Sheet
11
Revision 2.0, 2009-11-24
BGS12AL7-6 SPDT RF Switch
Measurement Results
5
Measurement Results
Insertion Loss RFin to RF1 / RFin to RF2
0.0 -0.2 -0.4
Return Loss RFin Port 0 -5 -10 Return Loss (dB) -15 -20 -25 -30 -35 -40 -45 -50 0.0 0.5 1.0 1.5 2.0 freq, GHz Isolation RFin to RF2 / RFin to RF1 0 -5 -10 -15 Isolation (dB) -20 -25 -30 -35 -40 -45 -50 2.5 3.0 3.5 4.0
Insertion Loss (dB)
-0.6 -0.8 -1.0 -1.2 -1.4 -1.6 -1.8 -2.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
RF1 mode RF2 mode
RF1 mode RF2 mode
freq, GHz Return Loss RF1 Port / RF2 Port 0 -5 -10 Return Loss (dB) -15 -20 -25 -30 -35 -40 -45 -50 0.0 0.5 1.0 1.5 2.0 freq, GHz Isolation RF1 to RF2 / RF2 to RF1 0 -5 -10 -15 Isolation (dB) Pout (dBm) -20 -25 -30 -35 -40 -45 -50 0.0 0.5 1.0 20 15 10 5 1.5 2.0 freq, GHz 2.5 3.0 3.5 4.0 8 10 12 14 16 25 30 2.5 3.0 3.5 4.0
RF1 mode RF2 mode
RF1 mode RF2 mode
0.0 0.5 1.0 1.5 2.0 freq, GHz Pin versus Pout (0.1dB Compression Point) 2.5 3.0 3.5 4.0
no compression observed up to 24dBm
RF1 mode RF2 mode
RF1/RF2 mode
18
20
22
24
26
28
30
BGS 12AL 7-6_measurement_ results_V 3.vsd
Pin (dBm)
Figure 3
Measurement Results (@ T = 25C)
Data Sheet
12
Revision 2.0, 2009-11-24
BGS12AL7-6 SPDT RF Switch
Measurement Results Application Board
BGS 12AL 7-6_applic ation _board .vsd
Figure 4
Application Board: No External Components Necessary
BGS 12AL 7-6_application _deem bedding _board .vsd
Figure 5
Deembedding Board
Data Sheet
13
Revision 2.0, 2009-11-24
BGS12AL7-6 SPDT RF Switch
Package Outlines
6
Package Outlines
Package TSLP7-6 _V3.vsd
Figure 6
Package TSLP7-6
Marking TSLP7-6_V 3.vsd
Figure 7
Marking Info
BGS12 AL7-6 _board _pad_ and_apertures _V2.vsd
Figure 8
Board pad (SMD) & Apertures
Data Sheet
14
Revision 2.0, 2009-11-24
BGS12AL7-6 SPDT RF Switch
Package Outlines
0.5
BGS 12AL7 -6_Tape_ and_Reel_ V1.vsd
Figure 9
Tape and Reel
Dimensions in mm You can find all of our packages, sorts of packing and others in our Infineon Internet Page "Products": http://www.infineon.com/products.
Data Sheet
15
Revision 2.0, 2009-11-24
www.infineon.com
Published by Infineon Technologies AG

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